Electronic circuit device and manufacturing method of the same
AssigneeDenso Corporation
InventorsKeiichi Sugimoto, Mitsuru Nakagawa
Life of this patent
Estimating the term…
Abstract
A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.
Claims10
An electronic circuit device, comprising:
- a circuit board mounted with a circuit part;
- a plurality of terminals, a part of each of which is mounted on the circuit board and electrically connected with the circuit board;
- and
- a casing made of a resin material, wherein
- the casing is formed to seal an entire body of the circuit part, a mounting face of the circuit board, on which the circuit part is mounted, and said parts of the terminals with the resin material,
- the casing is formed with an accommodation pocket for accommodating a battery,
- the other parts of the terminals are exposed to air in said accommodation pocket so that they can be electrically connected with a battery disposed therein, and
- the other face of the circuit board opposite from the mounting face provides a part of an outer surface of the casing, wherein
- the plurality of terminals are provided to contact a positive electrode and a negative electrode, respectively, of a battery disposed in said accommodation pocket,
- the circuit part and the terminals are electrically connected to the circuit board through soldering, and
- said resin material is a heat-hardening resin, whose hardening reaction temperature is lower than a melting point of a solder used to solder the circuit part and the terminals to the circuit board.
Dependencies are inferred from the claim text.