Light emitting diode package having dual lens structure for lateral light emission

A light emitting diode (LED) package having a dual lens structure comprising:

• an LED chip;
• a lower structure including a pair of electric connection parts for supplying power to the LED chip, a package body holding the electric connection parts, the package body having a recess for upwardly guiding light from the LED chip, and a transparent encapsulant filled in the recess of the package body to seal the LED chip;
• an upper-hemispheric lower lens fixed to a upper surface of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant;
• and
• a funnel-shaped upper lens fixed to an upper end of the lower lens, the upper lens including an axially symmetrical reflecting surface for laterally reflecting light from the lower lens and an emitting surface for laterally emitting light reflected from the reflecting surface,
• wherein the lower lens has a plurality of projections on a periphery of an undersurface thereof, and the lower structure has a plurality of grooves formed around the recess for receiving the projections.

A light emitting diode (LED) package having a duel lens structure comprising:

• an LED chip;
• a lower structure including a pair of electric connection parts for supplying power to the LED chip, a package body holding the electric connection parts, the package body having a recess for upwardly guiding light from the LED chip, and a transparent encapsulant filled in the recess of the package body to seal the LED chip;
• an upper-hemispheric lower lens fixed to an upper surface of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant;
• a funnel-shaped upper lens fixed to an upper end of the lower lens, the upper lens including an axially symmetrical reflecting surface for laterally reflecting light from the lower lens and an emitting surface for laterally emitting light reflected from the reflecting surface;
• and,
• a heat conducting part for supporting the LED chip within the package body, the heat conducting part having a recess formed on a position directly below the recess of the package body for upwardly reflecting light generated from the LED chip,
• wherein a portion of the heat conducting part and a portion of the package body around the LED chip are cut out to form a slit-shaped path extending to the electric connection part, and
• the LED chip is connected to the electric connection part by a wire through the slit-shaped path.