Apparatus and method for filling a ball grid array template

A method of filling a ball grid array template with solder balls, the ball grid array template being provided on one end of a base plate and having a plurality of locating holes extending therethrough, the base plate being capable of pivotal movement between a first pivot direction and a second, opposite pivot direction, and a solder ball supply bin being provided on a base plate that is capable of sliding thereon in the first and second pivot directions, the method comprising:

• (a) providing solder balls in the solder ball supply bin;
• (b) pivoting the base plate in the first pivot direction to allow solder balls located in the bin to move in the first pivot direction;
• (c) moving the solder ball supply bin over the base plate in the first pivot direction to the ball grid array template to thereby allow solder balls to fill one or more of the locating holes;
• (d) pivoting the base plate in the second pivot direction to allow solder balls located in the bin to move in the second pivot direction away from the ball grid array template;
• and
• (e) moving the solder ball supply bin over the base plate in the second pivot direction;
• wherein the bin is capable of holding solder balls between two oppositvely disposed side walls respectively connected by a rear side wall at one end and a pivoted ball gate at an opposite end, wherein during step (e) the ball gate pivots upon contact with solder balls that have not moved away from the ball grid array template.