Semiconductor device and a wire bonding method
AssigneeKabushiki Kaisha Shinkawa
InventorsTatsunari Mii, Shinichi Akiyama
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Abstract
A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.
Claims1
A wire bonding method that connects a first bonding point and a second bonding point by a wire, said method comprising, in the order stated, steps of:
- a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-banded ball;
- then
- a step that raises a capillary;
- then
- a step that moves the capillary toward a second bonding point;
- then
- a step that then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised to form a bent portion in said wire;
- then
- a step that raises the capillary to allow the wire to be paid out of the capillary;
- and then
- a step that moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.
Dependencies are inferred from the claim text.