Flip chip bonding tool
AssigneeASM Assembly Automation Ltd.
InventorsRan Fu, Deming Liu, Chi Chuen Chaw, Hing Leung Li, Chak Hau Pang, Hing Suen Siu
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Abstract
A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
Claims12
A bonding tool for bonding a semiconductor chip to a surface, comprising:
- a bonding tip comprising titanium carbide in a range of 30% to 90% and martensite, the bonding tip being operative to hold the chip under an ultrasonic agitation;
- and
- a bonding energy generator coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface.
A bonding tool for bonding a semiconductor chip to a surface, comprising:
- a bonding tip comprising a ceramic material in a hard phase and martensite in a soft phase that is operative to hold the chip under an ultrasonic agitation. the bonding tip further comprising a working surface contacting the chip during bonding, and the soft phase protrudes over the hard phase at the working surface;
- and
- a bonding energy generator coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface.
Dependencies are inferred from the claim text.