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US 7,458,413 B2Granted
Semiconductor chip heat transfer device
AssigneeInternational Business Machines Corporation
InventorLawrence S. Mok
Life of this patent
Estimating the term…
Abstract
A method and apparatus for improving the heat transfer from a semiconductor chip to its heat sinking device. The heat transfer device has a liquid chamber in which liquid is circulated within the chamber to spread the heat from one location of the chamber to the heat pipes partially mounted in the chamber. The heat is then carried away by the heat pipes to a remote heat sinking device. The chamber has built-in mechanism to allow the liquid to expand during normal operation and its expansion status to be monitored.
Claims19
A heat transfer device comprising:
- a liquid chamber;
- a plurality of microchannels forming a liquid channel assembly within said liquid chamber;
- a plurality of rotating blades;
- an external motor;
- a separator;
- and
- a plurality of heat pipes within said liquid chamber.
4 more elements
A heat transfer device comprising:
- a liquid chamber;
- a plurality of microchannels forming a liquid channel assembly within said liquid chamber;
- a plurality of rotating blades;
- an external motor;
- a separator;
- a plurality of heat pipes within said liquid chamber;
- said liquid chamber being filled with a heat transfer fluid and said plurality of rotating blades being driven by said external motor to circulate said fluid within said chamber;
- said liquid channel assembly being located in an inner wall to which heat is applied from outside of said inner wall;
- each of said plurality of heat pipes having one end partially inserted into said liquid chamber and another end of each of said plurality of heat pipes attached to a heat sink;
- said plurality of heat pipes comprising heat transfer fins on a perimeter of at least a portion of said plurality of heat pipes within said liquid chamber;
- said liquid chamber having liquid circulating within said liquid chamber to carry heat released from said liquid channel assembly to said plurality of heat pipes;
- said liquid chamber comprises a bellows structure that is expandable under pressure created by said liquid within said liquid chamber;
- said structure comprises a sealed and smaller sub-chamber within said liquid chamber;
- said sub-chamber and said liquid chamber forming an air space;
- said air space comprising an electronic detector for checking the temperature and pressure of the air within said air space;
- said detector functioning to check and detect said structure when said bellows are touching said detector;
- said detector functioning to check and detect an amount of liquid leaked out from said sub-chamber;
- said detector comprising wires connected to an outside monitoring circuitry;
- said liquid chamber comprising a pressure relief valve;
- and
- said liquid chamber comprising a liquid fill port.
18 more elements
Dependencies are inferred from the claim text.