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US 7,458,150 B2Granted
Method of producing circuit board
AssigneeDenso Corporation
InventorsMasashi Totokawa, Yasunori Ninomiya
Life of this patent
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Abstract
A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.
Claims20
A method of producing a circuit board having a multilayer wiring pattern, the method comprising:
- forming a plurality of thermoplastic resin films, wherein the forming includes a step of forming a through-hole in each of the plurality of thermoplastic resin films, and a step of printing in which a conductive paste including metal nano-particles is supplied to each of the plurality of thermoplastic resin film such that each of the through-holes is filled with the conductive paste and, at the same time a wiring pattern is formed on each of the plurality of thermoplastic resin films;
- stacking the plurality of thermoplastic resin films after the forming step;
- and
- sintering the plurality of thermoplastic resin films after the stacking step;
- wherein in the sintering, the thermoplastic resin are pressed with heat at a low oxygen condition including alcohol such that the plurality of thermoplastic resin films are integrated and the metal nano-particles of the conductive paste are sintered.
2 more elements
A method of producing a circuit board, the method comprising:
- providing a plurality of thermoplastic resin films;
- forming a through-hole in each of the plurality of thermoplastic resin films;
- filling each of the through-holes with a conductive paste including metal nano-particles;
- forming a wiring pattern with the conductive paste including metal nano-particles;
- stacking the plurality of thermoplastic resin films after the filling and forming steps;
- pressing the plurality of the plurality of thermoplastic resin films after the stacking step;
- applying heat to the plurality of thermoplastic resin films during the pressing step at a low oxygen condition including alcohol such that the plurality of thermoplastic resin films are integrated and the metal nano-particles are sintered.
4 more elements
Dependencies are inferred from the claim text.