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US 7,454,307 B2Granted
Method and system for detecting tilt or shift of wafer transferred onto hot plate in real time, and method system for monitoring baking process of wafers in real time
AssigneeUnited Microelectronics Corp.
InventorChih-Ming Chiang
Life of this patent
Estimating the term…
Abstract
A method for detecting a tilt or a shift of a wafer on a hot plate is described. A temperature variation of the hot plate is measured directly after the wafer is transferred onto the hot plate. The temperature variation is analyzed to determine whether or not a tilt or a shift of the wafer has occurred.
Claims22
A method for detecting a tilt or a shift of a wafer transferred onto a hot plate in real time, comprising:
- measuring a temperature variation of the hot plate directly after the wafer is transferred onto the hot plate;
- and
- analyzing the temperature variation to determine whether or not a tilt or a shift of the wafer has occurred.
A system for detecting a tilt or a shift of a wafer transferred onto a hot plate in real time, comprising:
- a first unit that measures a temperature variation of the hot plate directly after the wafer is transferred onto the hot plate;
- and
- a second unit connected with the first unit to receive data of the temperature variation therefrom, which analyzes the data of the temperature variation to determine whether or not a tilt or a shift of the wafer has occurred.
Dependencies are inferred from the claim text.