System and method for design and fabrication of a high frequency transducer
AssigneeRiverside Research Institute
InventorJeffrey A. Ketterling
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Abstract
Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.
Claims11
A high frequency ultrasound transducer device, comprising:
- a copperclad polyimide film;
- a layer of epoxy bonded to a first surface of said copperclad polyimide film;
- a polyvinylidene fluoride film bonded to said layer of epoxy on a first side thereof to thereby form an assembly;
- and
- a second epoxy bonded to a second surface of said copperclad polyimide film surface to fabricate into said high frequency ultrasound transducer.
Dependencies are inferred from the claim text.