Mark position measuring method and apparatus

A method of measuring a position of a mark in a chamber, said method comprising:

• a first detection step of detecting a reference mark fixedly disposed in the chamber using a detector disposed outside the chamber, while a pressure inside the chamber is equal to a pressure outside the chamber;
• a second detection step of detecting the reference mark using the detector, with the pressure inside the chamber being different from the pressure outside the chamber;
• a third detection step of detecting, using the detector, a mark, which is movable with respect to the reference mark in the chamber, while the pressure inside the chamber is different from the pressure outside the chamber;
• and
• a correction step of correcting a detection result of the third detection step based on detection results of the first and second detection steps.

An exposure apparatus for exposing a substrate to a pattern of an original, said apparatus comprising:

• a chamber, having a window, adapted to accommodate the original and the substrate, a pressure inside the chamber being different from a pressure outside the chamber;
• a reference mark fixedly disposed in the chamber;
• and
• a mark disposed on one of the original, an original stage holding the original, the substrate and a substrate stage holding the substrate, the mark movable with respect to the reference mark;
• a first illuminator, disposed inside the chamber, adapted to illuminate the reference mark;
• a second illuminator, disposed inside the chamber, adapted to illuminate the mark;
• a detector, disposed outside the chamber, adapted to detect positions of the reference mark and the mark through the window;
• and
• a calculation unit adapted to calculate a position of the mark with respect to the reference mark based on detection results of the reference mark and the mark.

An exposure apparatus for exposing a substrate to a pattern of an original, said apparatus comprising:

• a chamber, having a window, adapted to accommodate the original and the substrate;
• a reference mark fixedly disposed in the chamber;
• a mark disposed in the chamber, the mark movable with respect to the reference mark;
• a detector, disposed outside the chamber, adapted to detect positions of the reference mark and the mark through the window, the detector detecting the reference mark while the pressure inside the chamber is equal to the pressure outside the chamber, and the detector detecting the mark with the pressure inside the chamber being different from the pressure outside the chamber;
• and
• a correction unit adapted to correct a detection result of the mark based on detection results of the reference mark.

A device manufacturing method comprising:

• a step of exposing a substrate to a pattern of an original, using an exposure apparatus, to manufacture a device, the exposure apparatus comprising:
• (i) a chamber, having a window, adapted to accommodate the original and the substrate, a pressure inside the chamber being different from a pressure outside the chamber;
• (ii) a reference mark fixedly disposed in the chamber;
• (iii) a mark disposed on one of the original, an original stage holding the original, the substrate and a substrate stage holding the substrate, the mark movable with respect to the reference mark;
• (iv) a first illuminator, disposed inside the chamber, adapted to illuminate the reference mark;
• (v) a second illuminator, disposed inside the chamber, adapted to illuminate the mark;
• (vi) a detector, disposed outside the chamber, adapted to detect positions of the reference mark and the mark through the window;
• and
• (vii) a calculation unit adapted to calculate a position of the mark with respect to the reference mark based on detection results of the reference mark and the mark.