Loading a socket and/or adapter device with a semiconductor component

A process for loading a socket with a semiconductor component, the process comprising:

• aligning a semiconductor component in relation to a first socket loading apparatus, assistance of a centering device provided at the first socket loading apparatus and an alignment device, wherein the alignment device is not disposed within the socket;
• after aligning the semiconductor component, removing the first socket loading apparatus from the alignment device;
• grabbing the semiconductor component using a second socket loading apparatus after removing the first socket loading apparatus;
• aligning the second socket loading apparatus in relation to the socket, with assistance of a centering device provided at the second socket loading apparatus;
• and
• opening contacts in the socket with the second socket loading apparatus, wherein the opening comprises activating a mechanical device disposed within the socket by physically coupling a pin on the second socket loading apparatus to the mechanical device, wherein the mechanical device causes the contacts to open.

A system for testing a packaged component, the system comprising:

• a loading machine, the loading machine comprising,
• a loader head disposed on the loading machine, the loader head being capable of picking up the packaged component, and
• a projection disposed on the loader head;
• a socket comprising,
• a plurality of contacts that correspond to a plurality of pins on the packaged component,
• an opening mechanism wherein,
• the socket is pushed into an open position while the projection is placed within a receptacle,
• the socket can accept the packaged component while the socket is in the open position,
• the socket is in a closed position when the projection is absent from the receptacle, and
• the socket mechanically prevents release of the packaged component while the socket is in the closed position;
• a precision aligning device comprising a centering recess disposed on a planar surface, the centering recess dimensioned to push the packaged component into an aligned position when the loader head is in contact with the precision aligning device, wherein the precision aligning device and the socket are physically separate units;
• and
• a packaged device tester attached to the socket.

A system for testing a packaged component, the system comprising:

• a loading machine, the loading machine comprising,
• a loader head disposed on the loading machine, the loader head being capable of picking up the packaged component, and
• a projection disposed on the loader head;
• a socket comprising,
• a plurality of contacts that correspond to a plurality of pins on the packaged component,
• an opening mechanism wherein,
• the socket is pushed into an open position while the projection is placed within a receptacle,
• the socket can accept the packaged component while the socket is in the open position,
• the socket is in a closed position when the projection is absent from the receptacle, and
• the socket mechanically prevents release of the packaged component while the socket is in the closed position;
• a precision aligning device comprising a centering recess disposed on a planar surface, the centering recess dimensioned to push the packaged component into an aligned position when the loader head is in contact with the precision aligning device;
• a centering device comprising pins, wherein the pins align with corresponding centering openings disposed on the socket and/or with corresponding centering openings disposed on the precision aligning device, and wherein at any particular instance the centering device can not align with both the precision aligning device and the socket;
• and
• a packaged device tester attached to the socket.

An apparatus for loading a socket with a semiconductor component, the apparatus comprising:

• a grabber device for grabbing the semiconductor component;
• an aligning device for aligning the semiconductor component with the grabber device, the aligning device comprising a centering recess, the centering recess having an outer dimension substantially similar to an outer dimension of the semiconductor component, where the centering recess is positioned so that the semiconductor component becomes positioned on the grabber device to a correct position with respect to a socket when the grabber device is coupled with the aligning device;
• and
• a centering device comprising pins, wherein the pins align with corresponding centering openings disposed on the socket and/or with corresponding centering openings disposed on the aligning device, and wherein at any particular instance the centering device can not align with both the aligning device and the socket.