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US 7,453,154 B2Granted
Carbon nanotube via interconnect
AssigneeDelphi Technologies, Inc.
InventorsKiat Choon Teo, Wai Kwan Wong, Binghua Pan
Life of this patent
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Abstract
An electronic device that facilitates improved electrical and thermal performance and/or allows fabrication of smaller electronic devices exhibiting excellent performance characteristics, especially for devices operating at microwave frequencies, includes an input/output pad, and a carbon nanotube extending from the input/output pad to provide wafer-level nano-interconnect for flip chip interconnections and die stacking on a substrate.
Claims3
An electronic package comprising:
- a first electronic device including an electronic circuit having an input/output pad, and at least one electrically conductive carbon nanotube extending from the input/output pad and beyond a surface of the device to provide an interconnect;
- a second electronic device, the first electronic device mounted on the second electronic device to form a stacked arrangement;
- a substrate, the stacked arrangement mounted on the substrate, the carbon nanotube extending away from the first electronic device, through an opening in the second electronic device, and connected to the substrate.
Dependencies are inferred from the claim text.