Circuit device
AssigneeSanyo Electric Co., Ltd.
InventorsAtsushi Saita, Toshikazu Imaoka, Tetsuro Sawai, Yasunori Inoue
Life of this patent
Estimating the term…
Abstract
The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.
Claims11
A circuit device comprising:
- a substrate provided with ground wiring
- a plurality of circuit elements laminated on said substrate;
- a pair of insulation layers provided between at least one set of an upper-layer circuit element and a lower-layer circuit element disposed adjacent to each other, among said plurality of circuit elements;
- and
- a conductive layer interposed between said pair of insulation layers,
- wherein the upper-layer circuit element connects to the ground wiring by way of said conductive layer;
- the upper-layer circuit element, and a first wire connecting the upper-layer circuit element and the conductive layer are sealed by a first encapsulating resin;
- and
- the upper-layer circuit element sealed by the first encapsulating resin and a second wire connecting the conductive layer and the ground wiring are sealed by a second encapsulating resin.
A circuit device comprising:
- a ground wiring;
- a plurality of circuit elements laminated on said ground wiring;
- a pair of insulation layers provided between at least one set of an upper-layer circuit element and a lower-layer circuit element disposed adjacent to each other, among said plurality of laminated circuit elements;
- and
- a conductive layer interposed between said pair of insulation layers,
- wherein the upper-layer circuit element connects to said ground wiring by way of said conductive layer;
- the upper-layer circuit element, and a first wire connecting the upper-layer circuit element and the conductive layer are sealed by a first encapsulating resin;
- and
- the upper-layer circuit element sealed by the first encapsulating resin and a second wire connecting the conductive layer and the ground wiring are sealed by a second encapsulating resin.
Dependencies are inferred from the claim text.