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US 7,453,150 B1Granted
Three-dimensional face-to-face integration assembly
AssigneeRensselaer Polytechnic Institute
InventorJohn McDonald
Life of this patent
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Abstract
A via for connecting metallization layers of chips bonded in a face-to-face configuration is provided, as well as methods of fabricating the via. The via may function as an interconnection of metallization layers in three-dimensional, stacked, integrated circuits, and may enable high density, low-resistance interconnection formation.
Claims21
An integrated circuit assembly comprising:
- a first chip having a face surface comprising at least one first device and a back surface, the first chip including
- a first metal layer and
- a collet contacting the first metal layer, the collet having an opening therein;
- a second chip having a face surface comprising at least one second device, the second chip further comprising a second metal layer;
- the first chip and the second chip being bonded in a face-against-face contact configuration;
- and
- a via comprising
- a pillar portion disposed to pass through the opening of the collet and electrically contacting the second metal layer, and
- a nail head portion connected to the pillar portion and electrically contacting the collet.
6 more elements
A multi-wafer circuit assembly comprising:
- a first wafer having a face surface comprising at least one first device and a back surface, the first wafer including
- a first metal layer and
- a collet contacting the first metal layer, the collet having an opening therein;
- a second wafer having a face surface comprising at least one second device, the second wafer including a second metal layer;
- the first wafer and the second wafer being bonded in a face-against-face contact configuration, and
- a via comprising
- a pillar portion disposed to pass through the opening of the collet and electrically contacting the second metal layer, and
- a nail head portion connected to the pillar portion and electrically contacting the collet.
5 more elements
Dependencies are inferred from the claim text.