Semiconductor chip assembly with laterally aligned filler and insulative base

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes first and second opposing surfaces, wherein the first surface of the chip includes a conductive pad;
• a conductive trace that includes a routing line and a filler;
• a connection joint that electrically connects the routing line and the pad;
• an insulative base that includes an aperture;
• and
• an encapsulant that includes first and second opposing surfaces, wherein
• the first surface of encapsulant faces in a first direction;
• the second surface of the encapsulant faces in a second direction opposite the first direction;
• the chip is embedded in the encapsulant;
• the routing line
• contacts the filler within a periphery of the aperture,
• extends laterally beyond the filler towards the chip,
• extends vertically beyond the filler in the first direction where the routing line contacts the filler and
• extends vertically beyond the chip in the second direction;
• the filler
• contacts the insulative base in the aperture and
• extends vertically beyond the routing line in the second direction;
• the insulative base
• contacts the routing line,
• is overlapped by the chip and
• extends vertically beyond the chip, the routing line and the encapsulant in the second direction;
• the aperture
• extends through the insulative base in the first and second directions,
• extends vertically beyond the routing line in the second direction,
• does not extend vertically beyond the routing line in the first direction,
• has a diameter that decreases as the aperture extends in the second direction and
• has curved tapered sidewalls that slant inwardly as the aperture extends in the second direction;
• the filler and the aperture
• are disposed outside a periphery of the chip and
• are not covered in the second direction by
• the encapsulant,
• the insulative base or
• any other insulative material of the assembly;
• the filler, the aperture and the insulative base are laterally aligned with one another at a lateral surface that faces in the second direction;
• the insulative base surrounds and is adjacent to the filler at the lateral surface;
• the insulative base surrounds only the filler at the lateral surface where the insulative base is adjacent to the filler at the lateral surface;
• and
• the assembly is devoid of a printed circuit board.