Electronic circuit device and manufacturing method thereof
AssigneeHitachi, Ltd.
InventorsKazuhiko Kawakami, Noriyoshi Urushiwara
Life of this patent
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Abstract
The manufacturing method for an electronic circuit device comprises attaching an electronic circuit assembly including a circuit substrate with electronic circuit elements attached to a base, joining lead terminals integrally with the base via frames before molding the lead terminals composed of a different material from that of the base with mold resin, electrically connecting the lead terminals to the electronic circuit assembly, molding the electronic circuit assembly, lead terminals, and flange with mold resin in a batch partially excluding the flange and lead terminals installed on the base, and separating and removing the frames from the lead terminals and base after the molding with the mold resin.
Claims5
An electronic circuit device comprising:
- an electronic circuit assembly including a circuit substrate to which electronic circuit elements are attached;
- a base having a flange portion, said electronic circuit assembly being adhered to the base;
- and
- lead terminals made of a different member and different material from said base, which are electrically connected to said electronic circuit assembly, wherein said base, said lead terminals are arranged on substantially the same plane, and wherein said base, said electronic assembly, and said lead terminals are sealed with a sealing resin, except for said flange portion, and part of said lead terminals.
Dependencies are inferred from the claim text.