Method of fabricating a semiconductor light-emitting device
AssigneeRicoh Company, Ltd.
InventorsTakashi Takahashi, Morimasa Kaminishi, Shunichi Sato, Akihiro Itoh, Naoto Jikutani
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Abstract
A semiconductor light-emitting device has a semiconductor layer containing Al between a substrate and an active layer containing nitrogen, wherein Al and oxygen are removed from a growth chamber before growing said active layer and a concentration of oxygen incorporated into said active layer together with Al is set to a level such that said semiconductor light-emitting device can perform a continuous laser oscillation at room temperature.
Claims6
A method of fabricating a semiconductor light-emitting device, said semiconductor light-emitting device having a semiconductor layer containing Al between a substrate and an active layer of a nitrogen-containing III-V mixed crystal, said method comprising the steps of:
- heating a susceptor in a growth chamber;
- growing said semiconductor layer in said growth chamber while using a metal organic source of Al;
- and
- growing said active layer in said growth chamber while using a nitrogen compound source,
- wherein there is provided a step, after said step of growing said semiconductor layer containing Al but before a start of said step of growing said active layer, of removing residual Al species comprising one or more of an Al source, an Al reactant, an Al compound, and Al, remaining in said growth chamber, from a part of said growth chamber that can make a contact with said nitrogen compound source or an impurity contained in said nitrogen compound source, wherein said residual Al species is removed to an outside of said growth chamber.
A method of fabricating a semiconductor light-emitting device, said semiconductor light-emitting device having a semiconductor layer containing Al between a substrate and an active layer containing nitrogen, said method comprising the steps of:
- heating a susceptor in a growth chamber;
- growing said semiconductor layer in said growth chamber while using a metal organic source of Al;
- and
- growing said active layer in said growth chamber while using a nitrogen compound source,
- wherein there is provided a step, after said step of growing said semiconductor layer containing Al but before a start of said step of growing said active layer, of removing residual Al species comprising one or more of an Al source, an Al reactant, an Al compound, and Al, remaining in said growth chamber, from a part of said growth chamber that can make a contact with said nitrogen compound source or an impurity contained in said nitrogen compound source,
- wherein said step of removing said residual Al species is conducted by purging said residual Al species by a carrier gas.
A method of fabricating a semiconductor light-emitting device, said semiconductor light-emitting device having a semiconductor layer containing Al between a substrate and an active layer containing nitrogen, said method comprising the steps of:
- heating a susceptor in a growth chamber;
- growing said semiconductor layer in said growth chamber while using a metal organic source of Al;
- and
- growing said active layer in said growth chamber while using a nitrogen compound source,
- wherein there is provided a step, after said step of growing said semiconductor layer containing Al but before a start of said step of growing said active layer, of removing residual Al species comprising one or more of an Al source, an Al reactant, an Al compound, and Al, remaining in said growth chamber, from a part of said growth chamber that can make a contact with said nitrogen compound source or an impurity contained in said nitrogen compound source,
- wherein said step removing said residual Al species being conducted by a carrier gas, said step of purging being conducted while heating said susceptor.
Dependencies are inferred from the claim text.