Optical bumps for low-loss interconnection between a device and its supported substrate and related methods

An apparatus comprising:

• a substrate having a first surface including at least one first optically active area;
• a device configured to be electrically coupled to the substrate and substantially supported by the substrate, the device having a second surface including at least one second optically active area positioned in a spaced-apart and opposed relationship with respect to the at least one first optically active area;
• at least one optical bump coupled to the first surface between the at least one first optically active area and the at least one second optically active area;
• and
• at least one solder bump that contacts both the first surface and the second surface of the second device and that electrically couples the substrate to the device;
• wherein the at least one optical bump extends from the first surface to the second surface, and the at least one optical bump is rigid and configured both to couple light between the at least one second optically active area and the at least one first optically active area, and to act as a stand-off between the first surface and the second surface when the device is electrical coupled to the substrate by the at least one solder bump.