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US 7,453,045 B2Granted
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsBum-Young Myoung, Dek-Gin Yang, Dong-Kuk Kim
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Abstract
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.
Claims6
A rigid-flexible printed circuit board, comprising:
- a plurality of first base boards, each having a liquid crystalline polymer layer one or both sides of which are covered with a copper foil layer on which an inner circuit pattern is formed;
- a plurality of first coverlays, each deposited over a portion of the inner circuit pattern which corresponds to a flexible region;
- a plurality of adhesives through which the first base boards are bonded to each other in such a way that the crystalline liquid polymers face each other;
- a plurality of second base boards, each having an outer circuit pattern and being deposited over the first base board through an adhesive material;
- a plurality of second coverlays, each deposited over a portion of the outer circuit pattern, covering the flexible region of the second base board;
- and
- a plurality of solder masks for protecting the outer circuit pattern.
4 more elements
Dependencies are inferred from the claim text.