Method of polishing GaN substrate
AssigneeSumitomo Electric Industries, Ltd.
InventorNaoki Matsumoto
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Abstract
In a polishing method of a GaN substrate according to this invention, first, while supplying a polishing solution 27 containing abrasives 23 and a lubricant 25, onto a platen 101, the GaN substrate is polished using the platen 101 and the polishing solution 27 (first polishing step). Then the GaN substrate is polished using the platen 101 in which abrasives 29 are buried, while supplying a lubricant 31 onto the platen 101 in which the abrasives 29 are buried (second polishing step).
Claims14
A method of polishing a GaN substrate of which surface to be polished has Ga portions and N portions alternatively arranged, comprising:
- a first polishing step of polishing the GaN substrate held by a polishing jig, using a first platen made of a material including tin and a polishing solution, while supplying the polishing solution containing first abrasives and a first lubricant, onto the first platen;
- a second polishing step of polishing the GaN substrate held by the polishing jig, using a second platen, made of a material including tin, in which second abrasives are buried, while supplying a second lubricant onto the second platen in which the second abrasives are buried, after the first polishing step;
- and
- in at least one of the first and second polishing steps, rotating the first or second platen and the polishing jig in the same direction.
A polishing apparatus for a GaN substrate of which surface to be polished has Ga portions and N portions alternatively arranged, comprising:
- a polishing jig for rotatably holding the GaN substrate;
- and
- a platen made of a material including tin and configured to be rotated in the same direction as the polishing jig to polish the GaN substrate held between the polishing jig and the platen.
A method of polishing a GaN substrate, comprising:
- a first polishing step of polishing the GaN substrate held by a polishing jig, using a first platen and a polishing solution, while supplying the polishing solution containing first abrasives and a first lubricant, onto the first platen;
- a second polishing step of polishing the GaN substrate held by the polishing jig, using a second platen in which second abrasives are buried, while supplying a second lubricant onto the second platen in which the second abrasives are buried, after the first polishing step;
- and
- in at least one of the first and second polishing steps, rotating the first or second platen and the polishing jig in the same direction, wherein
- the first step including supplying the polishing solution between the GaN substrate and the first platen through grooves arranged in a surface of the polishing jig where the GaN substrate is held, and
- the second step including supplying the second lubricant between the GaN substrate and the first platen through the grooves.
A polishing apparatus for a GaN substrate, comprising:
- a polishing jig for rotatably holding the GaN substrate;
- and
- a platen configured to be rotated in the same direction as the polishing jig to polish the GaN substrate held between the polishing jig and the platen, wherein
- the polishing jig has radially extending grooves arranged in an area surrounding the GaN substrate.
Dependencies are inferred from the claim text.