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US 7,452,799 B2Granted
Ball film for integrated circuit fabrication and testing
AssigneeTexas Instruments Incorporated
InventorAkira Matsunami
Life of this patent
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Abstract
According to one embodiment of the invention, a method of fabricating ball grid array packages includes providing a substrate, providing a ball film that includes a plurality of metal balls movably contained within respective slots of a thin film, coupling the metal balls to the substrate, and removing the thin film from the metal balls.
Claims8
A method of fabricating ball grid array packages, comprising:
- providing a substrate;
- providing a ball film, the ball film comprising a plurality of metal balls each movably contained within a respective one of a plurality of slots of a thin film having a first thin film and second thin film, and each slot having a first opening with a first diameter on the first thin film and a second opening with a second diameter on the second thin film, a side wall including a portion of a sphere with a diameter greater than the first and the second diameter;
- coupling the metal balls to the substrate;
- and
- removing the thin film from the metal balls.
2 more elements
Dependencies are inferred from the claim text.