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AssigneeHitachi, Ltd.
InventorsTakeru Fujinaga, Kazuhiro Hirose, Hideaki Takemori, Toshiaki Koizumi
Estimating the term…
A chip mounting substrate for bonding a semiconductor chip to a substrate, comprises a solder layer on the substrate, the solder layer being connectable to a semiconductor chip, wherein the solder layer comprises a layer including δ-phase crystal grains of an Au—Sn alloy at a surface of the solder layer. The solder layer comprising a layer including δ-phase crystal grains of an Au—Sn alloy is formed at a surface of the solder layer. On mounting a semiconductor chip on the substrate, the substrate and the solder layer are heated and an image of the solder layer is shot to perform an image evaluation to detect the timing of mounting the semiconductor chip on the solder layer of the substrate and a position of the chip.
A method of producing a chip mounting substrate connectable to a semiconductor chip, comprising:
A method of mounting a semiconductor chip on a substrate comprising:
A method of producing a chip mounting substrate connectable to a semiconductor chip, comprising:
A method of mounting a semiconductor chip on a substrate comprising:
A method of producing a chip mounting substrate connectable to a semiconductor chip, comprising:
A method of producing a chip mounting substrate connectable to a semiconductor chip, comprising:
Dependencies are inferred from the claim text.