Self-aligned trench MOSFET structure and method of manufacture
AssigneeFairchild Semiconductor Corporation
InventorsChristopher Boguslaw Kocon, Nathan Lawrence Kraft
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AssigneeFairchild Semiconductor Corporation
InventorsChristopher Boguslaw Kocon, Nathan Lawrence Kraft
Estimating the term…
A trench gate FET is formed as follows. A well region is formed in a silicon region. A plurality of active gate trenches and a termination trench are simultaneously formed in an active region and a termination region of the FET, respectively, such that the well region is divided into a plurality of active body regions and a termination body region. Using a mask, openings are formed over the termination body region and the active body region. Dopants are implanted into the active body regions and the termination body region through the openings thereby forming a first region in each active and termination body region. Exposed surfaces of all first regions are recessed so as to form a bowl-shaped recess having slanted walls and a bottom protruding through the first region such that remaining portions of the first region in each active body region form source regions that are self-aligned to the active gate trenches.
A method of forming a trench gate field effect transistor (FET) in a semiconductor die comprising an active region for housing active transistor cells and a termination region surrounding the active region, the method comprising:
A method of forming a trench gate field effect transistor (FET) in a semiconductor die comprising an active region wherein active transistor cells are formed and a termination region surrounding the active region, the method comprising:
Dependencies are inferred from the claim text.