Method for manufacturing flexible printed circuit boards
AssigneeFoxconn Advanced Technology Inc.
InventorsChia-Shuo Hsu, Fu-Sing Huang, Chao-Ching Wang
Life of this patent
Estimating the term…
Abstract
A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically conducting layer; forming a wiring pattern at the electrically conducting layer; attaching a back film on a surface of the tape substrate; and cutting the tape substrate to get a number of flexible printed circuit boards attached on the back film.
Claims20
A method for manufacturing flexible printed circuit boards, the method comprising:
- providing a tape substrate having an electrically insulating layer and an electrically conducting layer;
- forming a plurality of flexible printed circuit boards in the tape substrate;
- attaching a continuous back film on a surface of the tape substrate;
- and
- cutting the tape substrate to separate the plurality of flexible printed circuit boards, each of the separated flexible printed circuit boards being attached on a same surface of the continuous back film.
A method fix manufacturing flexible printed circuit boards, said method comprising the following steps:
- providing a substrate comprising an electrically insulating layer and an electrically conducting layer;
- transferring the substrate between a pair of reels and attaching a continuous back film on the substrate when the substrate is transferred;
- transferring the substrate with the continuous back film attached thereon using a roll-to-roll system and forming a plurality of flexible printed circuit boards in the tape substrate when the substrate is transferred;
- and
- cutting the substrate to separate the flexible printed circuit boards, each of separated flexible printed circuit boards being attached on a same surface of the continuous back film.
A method for manufacturing flexible printed circuit boards, said method comprising the following steps:
- providing a substrate comprising an electrically insulating layer and an electrically conducting layer;
- transferring the substrate between a pair of reels and forming a plurality of flexible printed circuit boards in the substrate when the substrate is transferred;
- transferring the substrate having the plurality of flexible printed circuit boards using a roll-to-roll system and attaching a continuous back film on the electrically insulating layer of the substrate when the substrate is transferred;
- and cutting the substrate to separate the flexible printed circuit boards, each of separated flexible printed circuit boards being attached on a same surface of the continuous back film.
Dependencies are inferred from the claim text.