Production method of semiconductor chip

A method for producing a semiconductor chip, comprising:

• applying a photothermal conversion layer comprising a light-absorbing agent and a heat decomposable resin on a light-transmitting support, provided that upon irradiation of radiation energy, said photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat,
• preparing a semiconductor wafer having a circuit face with a circuit pattern and a non-circuit face on the side opposite said circuit face, laminating said semiconductor wafer and said light-transmitting support through a photocurable adhesive by placing said circuit face and said photothermal conversion layer to face each other, and irradiating light from said light-transmitting support side to cure the photocurable adhesive layer, thereby forming a laminated body having a non-circuit face on the outside surface,
• grinding the non-circuit face of said semiconductor wafer until said semiconductor wafer reaches a desired thickness,
• dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips,
• irradiating radiation energy from said light-transmitting support side to decompose said photothermal conversion layer, thereby causing separation into semiconductor chips having said adhesive layer and a light-transmitting support, and optionally
• removing said adhesive layer from said semiconductor chips.