Semiconductor package with contact support layer and method to produce the package

A method for assembling a semiconductor package comprising:

• providing a wafer including a front surface and an opposing back surface, and a plurality of semiconductor dies disposed on the front surface of the wafer, wherein each semiconductor die includes an active surface with a plurality of die contact areas;
• forming mushroom-shaped precursor conducting members on the die contact areas via an electro-plating technique, the mushroom-shaped precursor conducting members having a substantially rod-shaped lower portion and a rounded upper portion that is laterally larger than the lower portion;
• coating the front surface of the wafer and at least a base portion of each of the precursor conducting members with an electrically insulating layer;
• heating the wafer to form conducting members from the precursor conducting members;
• attaching a tape to upper surfaces of the conducting members and to an upper surface of the electrically insulating layer;
• thinning the back surface of the wafer;
• removing the tape;
• and
• separating individual semiconductor dies from the wafer.