Photodetecting device
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsFrédéric Dupont, Ian Cayrefourcq
Life of this patent
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Abstract
A method of manufacturing a photodetecting device, by providing a first wafer that includes a photosensitive layer made of a semiconductor material and a second wafer that includes a circuit layer of electronic components, with one of the photosensitive layer or the circuit layer incorporating a field isolation layer; bonding the first and second wafers to form a structure comprising successively the circuit layer, the field isolation layer and the photosensitive layer; and forming electrically conductive vias to electrically connect the photosensitive layer to at least some of the electronic components of the circuit layer. Also, photodetecting devices prepared by these methods.
Claims25
A method of manufacturing a photodetecting device, which comprises:
- providing a first wafer that includes a photosensitive layer made of a semiconductor material and a second wafer that includes a circuit layer of electronic components, with one of the photosensitive layer or the circuit layer incorporating a field isolation layer;
- bonding the first and second wafers to form a structure comprising successively the circuit layer, the field isolation layer and the photosensitive layer, and
- forming electrically conductive vias to electrically connect the photosensitive layer to at least some of the electronic components of the circuit layer;
- wherein the first wafer is formed by forming the photosensitive layer on a first substrate;
- bonding the photosensitive layer with a holding substrate of a transparent material on the photoreceptive side of the photosensitive layer;
- and removing the first substrate to provide the first wafer comprising the photosensitive layer and the holding substrate.
A method of manufacturing a photodetecting device, which comprises:
- providing a first wafer that includes a photosensitive layer made of a semiconductor material and a second wafer that includes a circuit layer of electronic components, with one of the photosensitive layer or the circuit layer incorporating a field isolation layer;
- bonding the first and second wafers to form a structure comprising successively the circuit layer, the field isolation layer and the photosensitive layer;
- and
- forming electrically conductive vias to electrically connect the photosensitive layer to at least some of the electronic components of the circuit layer;
- wherein the first wafer is provided by forming the photosensitive layer on a first substrate, and then removing the first substrate after bonding.
Dependencies are inferred from the claim text.