Method of fixing a probe needle to a needle fixture of a probe card in semiconductor inspection equipment
AssigneeSamsung Electronics Co., Ltd.
InventorsHyun-Sik Yu, Ji-Man Choi, In-Dae Shin
Life of this patent
Estimating the term…
Abstract
A needle fixture of a probe card and a needle fixing method in semiconductor inspection equipment include a needle fixture of a probe card in semiconductor inspection equipment including a printed circuit board; a needle fixture installed in the printed circuit board; a resin unit affixing a probe needle to the needle fixture using an adhesive; and a separation preventer for preventing separation of the resin unit from the needle fixture, wherein the separation preventer includes: a plurality of notches formed along a bottom surface of the needle fixture; and the adhesive filling the plurality of notches.
Claims15
A needle fixing method in the a probe card of semiconductor inspection equipment fixing a probe needle to a needle fixture, comprising:
- forming a plurality of notches along a bottom surface of the needle fixture;
- providing an adhesive between the bottom surface of the needle fixture and a predetermined portion of the probe needle, the adhesive filling the plurality of notches, such that the adhesive is being deposited to a uniform predetermined thickness over and in the plurality of notches on the bottom surface of the needle fixture;
- contacting the predetermined portion of the probe needle with the bottom surface of the needle fixture via the adhesive, such that the predetermined portion of the probe needle overlaps with the plurality of notches;
- and
- setting the adhesive.
A needle fixing method in a probe card of semiconductor inspection equipment fixing a probe needle to a needle fixture, comprising:
- forming a plurality of notches along a bottom surface of the needle fixture;
- providing an adhesive between the bottom surface of the needle fixture and a predetermined portion of the probe needle, the adhesive filling the plurality of notches;
- contacting the predetermined portion of the probe needle with the bottom surface of the needle fixture via the adhesive, such that the predetermined portion of the probe needle overlaps with the plurality of notches;
- and
- setting the adhesive,
- wherein providing the adhesive includes:
- depositing a first adhesive layer on the bottom surface of the needle fixture to cover and fill the plurality of notches;
- depositing a second adhesive layer on the predetermined position of the probe needle;
- and
- contacting an exposed bottom surface of the first adhesive layer with an exposed upper surface of the second adhesive layer.
A needle fixing method in a probe card of semiconductor inspection equipment fixing a probe needle to a needle fixture, comprising:
- forming a plurality of notches along a bottom surface of the needle fixture, the bottom surface of the needle fixture having a slope;
- providing an adhesive between the bottom surface of the needle fixture and a predetermined portion of the probe needle, the adhesive filling the plurality of notches;
- contacting the predetermined portion of the probe needle with the bottom surface of the needle fixture via the adhesive, such that the predetermined portion of the probe needle overlaps with the plurality of notches;
- and
- setting the adhesive.
Dependencies are inferred from the claim text.