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AssigneeKorean Advanced Institute of Science and Technology
InventorsSoo Hyun Kim, Jun Sok Lee, Jai Seong Choi, Gyung Soo Kang
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Disclosed herein are an apparatus for and a method of bonding a nano-tip using electrochemical etching, in which a good bonding stability can be provided. The nano-tip bonding apparatus comprises a glass plate having a top surface of a certain desired area. An electrolytic solution having conductivity is placed on the top surface of the glass plate by means of surface tension. Means for moving reciprocally a base material having conductivity in opposite direction is provided. A carbon nano-tube is adhered to a pointed tip of the base material by means of an adhesive. An end portion of the carbon nano-tube is to be immersed in the electrolytic solution. A power supply is provided for applying an electric power to the electrolytic solution and the base material.
An apparatus for bonding a nano-tip using electrochemical etching, the apparatus comprising:
A method of bonding a nano-tip using electrochemical etching, the method comprising steps of:
Dependencies are inferred from the claim text.