Downhole servicing compositions having high thermal conductivities and methods of using the same

Abstract

A downhole servicing composition comprising from about 15 percent to about 80 percent by weight of a clay, and from about 10 percent to about 75 percent by weight of a carbon source is disclosed. The invention includes a downhole servicing composition comprising from about 15 percent to about 45 percent by weight of a first clay, from about 15 percent to about 45 percent by weight of a second clay, from about 10 percent to about 35 percent by weight of a filler, and from about 10 percent to about 75 percent by weight of a carbon source. The invention also includes a downhole servicing composition comprising an aqueous base and from about 10 percent to about 75 percent by weight of flaked graphite, wherein the downhole servicing composition has a thermal conductivity not less than about 0.8 BTU/hr-ft-° F.

Dependencies are inferred from the claim text.