Connecting member for surface mounting circuit
AssigneeSankyo Kasei Kabushiki Kaisha
InventorsNorio Yoshizawa, Hiroaki Watanabe
Life of this patent
Estimating the term…
Abstract
A circuit pattern is formed on a printed circuit board, and a plating surface of a projecting stripe on a substrate is connected to the circuit pattern by soldering. Further, adhesive agent is filled in a gap between a coarsened surface of a non-circuit unit and the printed circuit board. When the adhesive agent is filled in the gap, the adhesive agent comes in an uneven portion of the coarsened non-circuit unit and is hardened in the recessed portion, so that a chemical bonding force of the adhesive agent itself and an anchoring effect act. For this reason, a fixing force and the bonding force increase.
Claims17
A surface mount electronic assembly, comprising:
- an electronic circuit board having circuit board conductive pattern areas and circuit board non-conductive areas;
- a connecting member substrate molded of electrically insulating resin;
- said connecting member substrate having a surface with a circuit portion formed thereon which is conductive, and non-circuit portion areas which are non-conductive, said surface being on a bonding side of said connecting member substrate;
- said surface of said connecting member substrate in said non-circuit portion areas being a coarsened surface;
- a non-conductive adhesive agent connecting said coarsened surface of said non-circuit portion areas to said circuit board non-conductive areas;
- and
- said circuit portion being connected to said circuit board conductive pattern areas by solder.
A surface mount electronic assembly, comprising:
- an electronic circuit board having circuit board conductive pattern areas and circuit board non-conductive areas;
- a connecting member substrate molded of electrically insulating resin;
- said connecting member substrate having a surface with a circuit portion formed thereon which is conductive, and non-circuit portion areas which are non-conductive, said surface being on a bonding side of said connecting member substrate;
- said surface of said connecting member substrate in said non-circuit portion areas being a coarsened surface;
- an adhesive mixture including a non-conductive adhesive agent and electrically conductive particles dispersed in the non-conductive adhesive agent;
- said adhesive mixture bonding said circuit board non-conductive areas to said non-circuit portion areas;
- and
- said adhesive mixture bonding the circuit board conductive pattern areas of said electronic circuit board to said circuit portion of said connecting member substrate.
A surface mount electronic assembly, comprising:
- an electronic circuit board having circuit board conductive pattern areas and circuit board non-conductive areas;
- a connecting member substrate molded of electrically insulating resin;
- said connecting member substrate having a surface with a circuit portion formed thereon which is conductive, and non-circuit portion areas which are non-conductive, said surface being on a bonding side of said connecting member substrate;
- said surface of said connecting member substrate in said non-circuit portion areas being a coarsened surface;
- a cream soldering agent which includes a resin as a non-conductive adhesive agent,
- said cream soldering agent bonding said circuit board non-conductive areas to said non-circuit portion areas;
- and
- said cream soldering agent bonding the circuit board conductive pattern areas of said electronic circuit board to said circuit portion of said connecting member substrate.
Dependencies are inferred from the claim text.