Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads

An interconnect assembly, comprising:

• a plurality of conductive contact bumps extending from a first side of, and in a direction away from a second side of, at least one bumped flex circuit assembly, the first side and the second side in opposition to one another, wherein each one of the plurality of conductive contact bumps extends to a distal end and has a lateral portion between the first side and the distal end;
• and
• a plurality of conductive contact pads, each of the pads having an attachment surface and a contact surface in opposition to one another, the attachment surface attached to a rigid printed circuit assembly, and the contact surface having i) a hole formed therethrough, and ii) an abutment zone formed adjacent to the hole, the abutment zone including an edge of the contact surface and the hole;
• wherein the lateral portions of the conductive contact bumps contact the abutment zones of respective conductive contact pads in arcuate lines of abutment, and wherein the abutment zones of the conductive contact pads are sized to prevent contact between the distal ends of the conductive contact bumps and the conductive contact pads.