Module for contactless chip cards or identification systems

A module for contactless chip cards or identification systems, comprising:

• a first antenna contact strip and a second antenna contact strip, each having a first surface and a second surface facing away from the first surface,
• a semiconductor chip having a main side, wherein the semiconductor chip is arranged on a region of the first antenna contact strip and the second antenna contact strip such that the main side faces the first surface of the first antenna contact strip and the first surface of the second antenna contact strip and the semiconductor chip is connected via contact means to the first surface of the first antenna contact strip and the first surface of the second antenna contact strip;
• and
• at least one adhesive film strip which at least partially covers the first and the second antenna contact strip,
• wherein the at least one adhesive film strip is arranged outside the region of the first and the second antenna contact strips which is covered by the semiconductor chip.

A module for contactless chip cards or identification systems, comprising:

• a first antenna contact strip and a second antenna contact strip, each having a first surface and a second surface facing away from the first surface;
• a semiconductor chip having at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip;
• and
• at least one adhesive film strip which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip,
• wherein the at least one adhesive film strip is arranged outside a region of the first and second antenna contact strips covered by the semiconductor chip.