Wire bonding wedge
AssigneeEdwards Enterprises
InventorRussell K. Bell
Life of this patent
Estimating the term…
Abstract
This invention is for a wedge for bonding an elongated conductor, such as a wire, to a bond pad on a microelectronic device. A wire passes through an aperture in the wedge into a pocket or an open notch. A sidewall on each side of the pocket or open notch prevents the wire from moving sideways. The wire passes over a foot that extends below the sidewalls by an amount sufficient to prevent the sidewalls from contacting the surface of the microelectronic device during bonding. The wire is bonded to a bond pad on a microelectronic device by feeding the wire through the aperture of the wedge and over the foot, pressing said wire between the foot and the bond pad, and applying bonding energy, such as ultrasonic energy, to the wire.
Claims19
A wedge for bonding an elongated conductor to a bond pad that is recessed beneath the surface of a microelectronic device, said wedge comprising:
- (A) a body having an aperture, said aperture comprising:
- an entrance opening through which said elongated conductor enters the body;
- and
- an exit opening at which said elongated conductor exits the body;
- (B) a sidewall beneath each side of said exit opening to prevent said elongated conductor from moving sideways;
- and
- (C) a foot having a back radius that extends completely across a width of the wedge, where said foot extends beneath said sidewalls by an amount sufficient to prevent said sidewalls from contacting the surface of said microelectronic device during bonding.
A pocket type wedge for bonding a wire to a bond pad that is recessed beneath the surface of a microelectronic device, said wedge comprising:
- (A) a body having an aperture, said aperture comprising:
- an entrance opening through which said wire enters the body;
- and
- an exit opening at which said wire exits the body;
- (B) a sidewall beneath each side of said exit opening to prevent said wire from moving sideways;
- and
- (C) a foot having a back radius that extends completely across a width of the wedge, where said foot extends about 0.0004 to about 0.0008 inches beneath said sidewalls, whereby no portion of said wedge contacts said surface during bonding.
An open notch type wedge for bonding a wire to a bond pad that is recessed below the surface of a microelectronic device, said wedge comprising:
- (A) a body having an aperture, said aperture comprising:
- an entrance opening through which said wire enters the body;
- an exit opening at which said wire exits the body;
- (B) a sidewall beneath each side of said exit opening to prevent said wire from moving sideways;
- and
- (C) a foot having a back radius that extends completely across a width of the wedge, where said foot extends about 0.0004 to about 0.0008 inches beneath said sidewalls, whereby no portion of said wedge contacts said surface during bonding.
Dependencies are inferred from the claim text.