Heat dissipation device with heat pipes
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsShi-Wen Zhou, Peng Liu, Chun-Chi Chen
Life of this patent
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Abstract
A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.
Claims16
A heat dissipation device for contacting with a heat generating electronic device to remove heat from the heat generating electronic device, the heat dissipation device comprising:
- a base for thermally engaging with the electronic device, having a face;
- a plurality of fins arranged on the face of the base;
- and
- a first heat pipe located between the base and the fins, and sinuously positioned on the face of the base, the first heat pipe having a first section located at a central portion of the base, and a plurality of second sections located at lateral portions of the base;
- a second heat pipe having a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins;
- wherein the first heat pipe comprises two second sections located at two opposite lateral portions of the base.
A heat dissipation device comprising:
- a base having a bottom face for thermally engaging with a heat generating electronic device and a top face;
- a first heat pipe sinuously engaging with the base and having a plurality of sections thereof spreading on a central and lateral portions of the base;
- two second heat pipes each having a first section thermally engaging with the base and a second section extending remotely from the base;
- and
- a plurality of fins thermally engaging with the second sections of the two second heat pipes;
- wherein the first heat pipe comprises a first section located at the central portion of the base, two second sections located at two opposite lateral portions of the base, two third sections located at another two opposite lateral portions of the base and connecting corresponding second sections and the first section of the first heat pipe.
A heat dissipation device comprising:
- a base for thermally connecting with a heat-generating electronic component;
- a serpentine first heat pipe horizontally embedded in a face of the base;
- a plurality of fins mounted on the base and thermally connecting therewith;
- and
- a second heat pipe having a first portion thermally connecting with the base and a second portion extending through the fins and thermally connecting therewith;
- wherein the first heat pipe comprises two end portions located at two opposite lateral portions of the base.
Dependencies are inferred from the claim text.