Method for fabricating a printed circuit board
AssigneeMotorola, Inc.
InventorsJaroslaw A. Magera, Gregory J. Dunn, Jovica Savic
Life of this patent
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Abstract
Fabricating (100, 1300) a printed circuit board includes fabricating patterned conductive traces (305, 310, 1410, 1415) onto a foil, laminating the patterned conductive traces to a printed circuit board substrate (405, 1505) by pressing on the foil, such that the conductive traces are pressed into a dielectric layer of the printed circuit board, and removing the foil to expose a co-planar surface of conductive trace surfaces and dielectric surfaces. Removal may be done by peeling (125) and/or etching (130, 1315).
Claims15
A method for fabricating a printed circuit board, comprising:
- plating an etch stop layer on a thin foil;
- forming patterned conductive traces on the etch stop layer;
- laminating the patterned conductive traces to a printed circuit board substrate such that the patterned conductive traces are pressed into a dielectric layer of the printed circuit board;
- and
- removing the thin foil by chemical etching to expose a co-planar surface of dielectric surfaces and either patterned conductive trace surfaces or patterned etch stop surfaces.
A method for fabricating a printed circuit board, comprising:
- pattern plating conductive traces on a carrier foil, wherein the conductive traces and carrier foil are formed from different metals, and wherein the carrier foil dissolves substantially faster than the conductive traces when exposed to an etchant;
- laminating the pattern plated conductive traces to a printed circuit board substrate such that the conductive traces are pressed into a dielectric layer of the printed circuit board;
- and
- removing the carrier foil by chemical etching using the etchant, exposing a co-planar surface of patterned conductive trace surfaces and dielectric surfaces.
Dependencies are inferred from the claim text.