Method of making a conformal electromagnetic interference shield

A method of manufacturing an electronic module comprising:

• providing an electronic meta-module comprising a substrate, circuitry on a surface of the substrate and associated with a plurality of electronic modules, and a body formed from a dielectric material that covers the circuitry associated with the plurality of electronic modules, wherein each of the plurality of modules is associated with a conductive element that is covered by the body;
• exposing at least a portion of the conductive element associated with each of the plurality of electronic modules through the body to provide exposed conductive elements;
• forming an electromagnetic shield over portions of an exterior surface of the body for each of the plurality of electronic modules and on the exposed conductive elements, by:
• generating a seed layer of conductive material on the exterior surface of the body for each of the plurality of electronic modules and on the exposed conductive elements;
• generating a second layer of material on the seed layer through an electrolytic plating process;
• and
• generating a third layer of material on the second layer through a second electrolytic plating process;
• and
• separating each of the plurality of electronic modules of the electronic meta-module from each other, wherein each of the plurality of electronic module comprises an electromagnetic shield, which is electrically coupled to a corresponding one of the exposed conductive elements.