System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

An optical waveguide circuit disposed within a printed circuit board comprising:

• a flexible optical waveguide film;
• an electrical-to-optical transmitter connected to the flexible optical waveguide film;
• a heat sink for the electrical-to-optical transmitter disposed within a cavity of the printed circuit board the heat sink comprising a thermal conductive material disposed within the cavity wherein the thermal conductive material is thermally coupled to a bottom surface of the electrical-to-optical transmitter and at least a portion of the thermal conductive material extends approximately to an outer surface of a layer of the printed circuit board;
• a photoelectric detector connected to the flexible optical waveguide film;
• and
• a first and second waveguide mirror couplers to optically couple the electrical-to-optical transmitter to the photoelectric detector via the flexible optical waveguide film, wherein the waveguide mirror couplers have an angle of 45 degrees plus or minus 1.5 degrees and a coupling efficiency greater than 90%.