Method and apparatus for performing failure analysis with fluorescence inks

A method for performing failure analysis on a semiconductor device under inspection, comprising:

• preparing of a sample of the semiconductor device under inspection using an encapsulation material containing a dye, the prepared device sample possibly including at least one failure area containing wicked in encapsulation material containing the dye;
• sectioning the prepared device sample to facilitate viewing a cross section face of the device under inspection;
• performing a dark field analysis on the prepared device sample with the use of dark field illumination, wherein responsive to at least one failure area containing wicked in encapsulation material with dye occurring on the cross section face of the device under inspection, the failure area can be readily identified as well as a contrast and perspective of remaining portions of the cross section face being maintained;
• and
• prior to preparing and sectioning the device sample, performing an initial assessment of the device under inspection with the use of acoustic scanning to determine a location for cross sectioning the device sample, the location corresponding to a potential failure area or point of delamination in the device sample.

A method of manufacturing a semiconductor device comprising:

• fabricating the semiconductor device;
• performing a failure analysis on the semiconductor device, the failure analysis including
• (a) preparing of a sample of the semiconductor device under inspection using an encapsulation material containing a dye, the prepared device sample possibly including at least one failure area containing wicked in encapsulation material containing the dye, (b) sectioning the prepared device sample to facilitate viewing a cross section face of the device under inspection, and (c) performing a dark field analysis on the prepared device sample with the use of dark field illumination, wherein responsive to at least one failure area containing wicked in encapsulation material with dye occurring on the cross section face of the device under inspection, the failure area can be readily identified as well as a contrast and perspective of remaining portions of the cross section face being maintained;
• adjusting the manufacturing process in response to an outcome of the failure analysis;
• and
• repeating the sectioning of the prepared device sample to facilitate viewing another cross-section face of the device under inspection, and performing dark field analysis on the another cross section face of the prepared device sample with the use of dark field illumination.