Electronic system
AssigneeVIA Technologies, Inc.
InventorsRobert Kuo, James Hsyu, Langhans Chang, Stanley Huang
Life of this patent
Estimating the term…
Abstract
An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole. The first conducting element is disposed on one side of the circuit board, and the second conducting element is disposed on the other side of the circuit board. The connecting element is disposed through the through hole for connecting the first conducting element and the second conducting element.
Claims18
An electronic system, comprising:
- a circuit board having at least one through hole and at least one grounding unit disposed around the through hole;
- a first conducting element disposed on one side of the circuit board;
- a second conducting element disposed on the other side of the circuit board;
- and
- at least one connecting element passing through the through hole and connecting a surface of the first conducting element to a surface of the second conducting element, wherein the surface of the first conducting element and the surface of the second conducting element both face the circuit board, at least one resilient member electrically connecting the grounding unit with the first conducting element and the second conducting element, wherein the connecting element passes through the resilient member, wherein the grounding unit comprises a first grounding portion and a second grounding portion, and the resilient member comprises a first elastic component electrically connecting the first grounding portion with the first conducting element, and a second elastic component electrically connecting the second grounding portion with the second conducting element.
An electronic system, comprising:
- a circuit board having at least one through hole and at least one grounding unit disposed around the through hole;
- at least one chip disposed on the circuit board and electrically connecting to the circuit board;
- a first conducting element disposed on one side of the circuit board;
- a second conducting element disposed on the other side of the circuit board;
- and
- at least one connecting element passing through the through hole, connecting a surface of the first conducting element with a surface of the second conducting element, and electrically connecting to the grounding unit, wherein the surface of the first conducting element and the surface of the second conducting element both face the circuit board, at least one resilient member electrically connecting the grounding unit with the first conducting element and the second conducting element, wherein the connecting element passes through the resilient member, wherein the grounding unit comprises a first grounding portion and a second grounding portion, and the resilient member comprises a first elastic component electrically connecting the first grounding portion with the first conducting element, and a section elastic component electrically connecting the second grounding portion with the second conducting element.
Dependencies are inferred from the claim text.