Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly

An apparatus comprising:

• a first thermally conductive member comprising a silicone rubber member mounted on an opposite face of a circuit board from a face of the circuit board on which an electrical component is mounted, the electrical component comprising an electrical device encapsulated in a ball grid array package, the contacts of the ball grid array package soldered to the face of the circuit board on which the electrical component is mounted, the first thermally conductive member operable to conduct heat generated by the electrical component through the contacts of the ball grid array package and the circuit board away from the electrical component, wherein the first thermally conductive member further comprises a thermally conductive block in contact with the silicone rubber member and a thermally conductive phase change material in contact with the thermally conductive block and with an enclosure enclosing the circuit board.