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US 7,443,683 B2Granted
Cooling apparatus for electronic devices
AssigneeHewlett-Packard Development Company, L.P.
InventorTom J. Searby
Life of this patent
Estimating the term…
Abstract
In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core structure is at least partially elongated in the direction parallel to the mounting base toward outer extremities of the plurality of fins.
Claims14
A system, comprising:
- a chassis;
- an electronic component disposed in the chassis;
- and
- a heat sink disposed on the electronic component, wherein the heat sink comprises a plurality of convective heat transfer members extending outwardly from a conductive heat transfer member, wherein the conductive heat transfer member has lateral extension portions extending outwardly from a core in an air flow direction toward outer extremities of the plurality of convective heat transfer members, and the lateral extension portions have a geometry that varies along the air flow direction, wherein the heat sink comprises an air flow path in the air flow direction into the heat sink at a first side, completely through the heat sink, and out of the heat sink at a second side opposite from the first side.
1 more element
A system, comprising:
- a chassis;
- an electronic component disposed in the chassis;
- and
- a heat sink comprising a mounting base disposed on the electronic component, wherein the heat sink comprises:
- a conductive heat transfer member that extends in a first direction perpendicular to the mounting base, wherein the conductive heat transfer member is elongated in a second direction parallel to the mounting base, and the conductive heat transfer member becomes increasingly elongated in the second direction the farther the conductive heat transfer member extends in the first direction from the mounting base;
- and
- a plurality of convective heat transfer members extending outwardly from the conductive heat transfer member.
4 more elements
A system, comprising:
- a chassis;
- an electronic component disposed in the chassis;
- and
- a heat sink comprising a mounting base disposed on the electronic component, wherein the heat sink comprises:
- a conductive heat transfer member that extends in a first direction transverse to the mounting base;
- and
- a plurality of fins extending outwardly from the conductive heat transfer member in a second direction parallel to the mounting base, wherein the conductive heat transfer member comprises a lateral extension portion having a curved geometry extending in the second direction in contact with the fins, and the curved geometry becomes increasingly narrow in the second direction toward outer extremities of the plurality of fins.
4 more elements
A system, comprising:
- a chassis;
- an electronic component disposed in the chassis;
- and
- a heat sink comprising a mounting base disposed on the electronic component, wherein the heat sink comprises:
- a conductive heat transfer member that extends in a first direction transverse to the mounting base;
- and
- a plurality of convective heat transfer members extending outwardly from the conductive heat transfer member in a second direction parallel to the mounting base, wherein the conductive heat transfer member comprises a curved geometry that varies in thickness in the second direction in contact with the plurality of convective heat transfer members, and the heat sink comprises an air flow path into a first side of the heat sink, completely through the heat sink, and out of an opposite second side of the heat sink.
4 more elements
Dependencies are inferred from the claim text.