Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorDong-Yun Li
Life of this patent
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Abstract
A heat dissipation device adapted for dissipating heat of a CPU and other electronic components such as MOSFETS mounted on a printed circuit board, includes a base mounted on the CPU, a fin set disposed on the base and a fan attached to a lateral side of the base and the fin set. The lateral side of the base is provided with an air-guiding part facing the fan, to guide a lower portion of airflow generated by the fan to pass through the electronic components such as MOSFETS mounted on the printed circuit board and around the CPU. An upper portion of the airflow flows through the fin set.
Claims14
A heat dissipation device adapted for dissipating heat from a CPU mounted on a printed circuit board, comprising:
- a base for being mounted on the CPU;
- a fin set disposed on the base;
- and
- a fan attached to the fin set by a duct;
- wherein the lateral side of the base is provide with an air-guiding part facing the fan, the air-guiding part guiding a lower, small portion of an airflow generated by the fan to pass through electronic components mounted on the printed circuit board and around the CPU, the electronic components being located below the air-guiding part, an upper, large portion of the airflow flowing through the fin set.
A heat dissipation device adapted for dissipating heat from a CPU mounted on a printed circuit board, comprising:
- a base mounted on the CPU;
- a fin set comprising a plurality of spaced fins mounted on the base, each fin being horizontally oriented;
- a heat pipe group comprising at least a heat pipe having an evaporating section embedded in a bottom surface of the base and two condensing sections bent from two opposite ends of the evaporating section and extending vertically through the fins;
- and
- a fan attached to the fin set by a duct;
- wherein the lateral side of the base is provided with an air-guiding part facing the fan, the air-guiding part guiding a lower, small portion of an airflow generated by the fan to pass through a plurality of electronic components mounted on the printed circuit board and around the CPU, the electronic components being located below the air-guiding part, an upper, large portion of the airflow flowing through the fin set.
Dependencies are inferred from the claim text.