Packaging for an interferometric modulator
AssigneeIdc, LLC
InventorsLauren Palmateer, Brian J. Gally, William J. Cummings, Manish Kothari, Clarence Chui
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Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
Claims27
A display apparatus package, comprising:
- a transparent substrate;
- a plurality of interferometric modulator arrays formed on a back side of the substrate;
- a back plate;
- a seal circumscribing each of said arrays and joining the back plate to the back side of the substrate to form a multiple sub-packages wherein each sub-package comprises one of said arrays;
- and
- a desiccant inside the multiple sub-packages,
- wherein the transparent substrate comprises scribed lines between the multiple sub-packages.
Dependencies are inferred from the claim text.