Coil package and bias tee package

A bias tee package for supplying a high-frequency signal by superposing a DC component thereon, comprising:

• a cone/pyramid-shaped coil having a conical or pyramidal shape formed by a conductor wire wound around an outer peripheral surface of a core in a manner such that a winding diameter of said coil progressively decreases from one end to the other end of said coil, said cone/pyramid-shaped coil eliminating high-frequency components of the DC component;
• a capacitor for passing the high-frequency signal therethrough to eliminate low-frequency components;
• and
• a dielectric substrate,
• wherein said cone/pyramid-shaped coil, said capacitor, and said dielectric substrate are integrated with each other, by forming a hole in said dielectric substrate, for inserting a tip portion of said cone/pyramid-shaped coil, making a bottom of the hole and a back surface of said dielectric substrate electrically continuous by a first via, placing said cone/pyramid-shaped coil in the hole by directing a small-diameter side of said cone/pyramid-shaped coil toward the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from said cone/pyramid-shaped coil to each other, connecting an electrode on a large-diameter side of said cone/pyramid-shaped coil to an electrode on said dielectric substrate, cutting said dielectric substrate to form a cutout and disposing said capacitor in the cutout, and making opposite ends of said capacitor and the back surface of said dielectric substrate electrically continuous by a second via to thereby cause said tip-side lead wire and one end of said capacitor to be connected to each other.