Circuit device and method of manufacture thereof
AssigneesSanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
InventorNoriaki Sakamoto
Life of this patent
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Abstract
A circuit device 10 comprises a die pad 11, bonding pads 12, a circuit element 9, affixed onto die pad 11, and an insulating resin 14, which seals die pad 11, bonding pads 12, and circuit element 9, and has a configuration wherein recessed parts 15 are formed at parts of the side surfaces of insulating resin 14, and side surface of the conductive patterns that are disposed at peripheral parts are exposed from recessed parts 15. By bonding pads 12, which are to become connecting electrodes to the exterior, being exposed at the side surfaces, fillets of a brazing material 19 are formed at the sides of the device when circuit device 10 is mounted.
Claims10
A circuit device comprising:
- a conductive pattern;
- a circuit element, affixed onto the conductive pattern;
- and an insulating resin, sealing the conductive pattern and the circuit element while exposing at least a bottom surface of the conductive pattern;
- wherein recessed areas are formed individually and are in side surfaces of the insulating resin such that outwardly facing outer peripheral parts of the conductive pattern are exposed from within the recessed areas, and
- wherein the top surface of the circuit device consists of insulating resin.
A circuit device comprising:
- a conductive pattern;
- a circuit element, affixed onto the conductive pattern;
- and an insulating resin, sealing the conductive pattern and the circuit element while exposing at least a bottom surface of the conductive pattern;
- wherein recessed areas are in side surfaces of the insulating resin such that outwardly facing outer peripheral parts of the conductive pattern are exposed from within the recessed areas and are not aligned with a side surface of the insulating resin, and
- wherein the top surface of the circuit device consists of insulating resin.
Dependencies are inferred from the claim text.