Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

An integrated circuit comprising:

• an integrated circuit package;
• a plurality of circuit elements disposed within the integrated circuit package;
• and
• a plurality of wire bonds;
• whereby the plurality of wire bonds are formed by the steps of:
• (i) measuring a plurality of bond distances within the integrated circuit, each bond distance corresponding to one of the plurality of wire bonds to be formed;
• (ii) calculating an area under a hypothetical wire bond profile as a function of the plurality of bond distances, a baseline wire length, and a baseline loop height;
• and (iii) bonding a wire across a given one of the plurality of bond distances to form a given one of the plurality of wire bonds;
• the bonding step being configured to provide a wire bond profile for the given wire bond having an area thereunder that is substantially equal to the calculated area in step (ii).