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US 7,443,040 B2Granted
Aluminum cap with electroless nickel/immersion gold
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorMarvin Lo
Life of this patent
Estimating the term…
Abstract
A resulting solder bump structure comprising the following steps. A structure having a metal bond pad formed thereover is provided. A patterned cover layer is formed over the structure. The patterned cover layer including an opening exposing a portion of the metal bond pad. The patterned cover layer opening including side walls. A metal cap layer is formed over at least the exposed portion of the metal bond pad and the patterned cover layer side walls. A solder bump is formed over the metal cap layer.
Claims27
A solder bump structure, comprising:
- a structure;
- a metal bond pad on the structure;
- a patterned cover layer over the structure, the patterned cover layer including an opening exposing a portion of the metal bond pad, the patterned cover layer opening including side walls;
- a metal cap layer over at least the exposed portion of the metal bond pad and the patterned cover layer side walls, the metal bond pad and the metal cap layer are each comprised of the same metal;
- a double zincation activated surface on the metal cap layer;
- and
- a solder bump over the metal cap layer to form the solder bump structure.
4 more elements
A solder bump structure, comprising:
- a structure;
- a metal bond pad on the structure;
- a patterned cover layer over the structure, the patterned cover layer including an opening exposing a portion of the metal bond pad, the patterned cover layer opening including side walls;
- a metal cap layer over at least the exposed portion of the metal bond pad and the patterned cover layer side walls, the metal bond pad and the metal cap layer are each comprised of the same metal, and the metal cap layer including a double zincation activated upper surface;
- a electroless nickel layer over the double zincation activated upper surface of the metal cap layer;
- an immersion gold layer over the electroless nickel layer;
- and
- a solder bump over the immersion gold layer to form the solder bump structure.
5 more elements
Dependencies are inferred from the claim text.