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US 7,443,039 B2Granted
System for different bond pads in an integrated circuit package
AssigneeST Assembly Test Services Ltd.
InventorsLun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae-Yong Song, Won Sun Shin
Life of this patent
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Abstract
An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.
Claims10
An integrated circuit package comprising:
- a substrate having first and second contact pads thereon exposed through a passivation layer thereon;
- a first metallurgy layer over the second contact pad separated from the substrate by the passivation layer;
- a second metallurgy layer over the first metallurgy layer over the second contact pad and separated from the substrate;
- and
- a protective layer only over the first contact pad without the first and second metallurgy layers thereover.
2 more elements
An integrated circuit package comprising:
- a substrate having first and second contact pads thereon exposed through a passivation layer thereon;
- a first under bump metallurgy layer over the second contact pad separated from the substrate by the passivation layer;
- a second under bump metallurgy layer over the first under bump metallurgy layer and separated from the substrate;
- a protective layer only over the first contact pad without the first and second under bump metallurgy layers thereover;
- and
- additional substrates connected to the substrate by the first and second contact pads.
3 more elements
Dependencies are inferred from the claim text.