Flip-chip image sensor packages

An electronic device package comprising:

• a transparent substrate;
• a pattern of conductive traces disposed on a surface of the transparent substrate, each conductive trace of the pattern of conductive traces extending between a first attachment point and a second attachment point;
• at least one optically interactive electronic device having a first surface and a second, opposing surface, the first surface including at least one bond pad and sensing circuitry, the at least one optically interactive electronic device mounted to the transparent substrate with a conductive bump extending between the first attachment point of a conductive trace of the pattern of conductive traces and the at least one bond pad, wherein the conductive bump has a thickness providing a gap between the first surface of the at least one optically interactive electronic device and the surface of the transparent substrate;
• a polymer sealant material contacting at least one side of the at least one optically interactive device and the surface of the transparent substrate to seal a volume including the sensing circuitry between a portion of the at least one optically interactive device and the surface of the transparent substrate from the outside environment, the polymer sealant material extending from the surface of the transparent substrate to a location not beyond the second surface of the optically interactive device;
• and
• a discrete conductive element attached to the second attachment point of the conductive trace, the discrete conductive element extending outwardly from the second attachment point in a direction perpendicular to a plane of the surface of the transparent substrate and to a distance beyond the second surface of the at least one optically interactive electronic device.